Industry News | 2013-04-25 16:35:51.0
Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.
Industry News | 2010-04-12 15:30:49.0
IPC APEX Expo Conference and Exhibition, Las Vegas – Design engineers in the electronics industry who are seeking ways to improve power integrity and reduce electromagnetic interference (EMI) while meeting halogen-free requirements now have a new solution to meet their needs. The 3M Electronic Solutions Division now offers halogen-free* versions of its Embedded Capacitance Material (ECM).
Industry News | 2013-10-04 16:50:46.0
Engineered Material Systems Inc will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif.
Industry News | 2014-07-21 15:43:47.0
Isola Group announced that its technical staff would offer a conversion service for PCB fabricators of radio frequency (RF) and millimeter-wave applications. This global 24-hour design review service will enable PCB fabricators to quickly and cost-effectively transition their current RF substrates to Isola's RF products and eliminate the production backlogs caused by the current shortages of RF substrates.
Industry News | 2017-03-14 10:58:12.0
Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.
Industry News | 2018-05-08 19:23:28.0
Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place May 28-30, 2018 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low-cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W3, Booth 806.
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
Industry News | 2010-06-21 14:39:59.0
Christopher Associates Inc. will be exhibiting at Intersolar North America 2010 in San Francisco’s Moscone Center West Hall from July 13-15, Level 3, booth 9247. The company will display a comprehensive portfolio of new technologies.
Industry News | 2022-10-04 11:23:40.0
MacDermid Alpha Electronics Solutions will present the technical paper 'Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces' at the TechBlick Conference and Expo taking place October 12-13 in Eindhoven, Netherlands.
Industry News | 2016-08-17 09:26:56.0
AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
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