Industry News: latent (Page 1 of 3)

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

atg Luther & Maelzer GmbH to Display A5-8 High-Speed Flying Prober at APEX 2010

Industry News | 2010-03-24 13:02:29.0

March 2010 — atg Luther & Maelzer GmbH, in cooperation with Everett Charles Technologies, announces that it will highlight its A5-8 Head High-Speed Flying prober in parent company Everett Charles Technologies booth #1782 at the upcoming IPC/APEX conference and exhibition.

atg Luther & Maelzer GmbH

Circuits Assembly Awards Seika Machinery for Test & Inspection – ICT

Industry News | 2014-03-26 08:48:51.0

Seika Machinery, Inc.announces that it has been awarded a 2014 NPI Award in the category of Test & Inspection – ICT for its HIOKI FA1240 Flying Probe Tester.

Seika Machinery, Inc.

EVS Helps Reduce Waste Dross by 85 Percent! Learn More at APEX

Industry News | 2017-01-09 18:20:54.0

EVS International will showcase the new EVS 500LF lead-free version and EVS 8KLFHS in the Sono-Tek booth (#2700) at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.

EVS International

Hioki’s Hiroshi Yamazaki to Present at the IPC APEX EXPO

Industry News | 2014-03-18 14:06:50.0

Seika Machinery, Inc. today announced that Hiroshi Yamazaki, Assistant Manager at Hioki E.E. Corporation, will present during the APEX 2014 Technical Conference Session Test II on Thursday, March 27, 2014 from 10 a.m.-12 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.

Seika Machinery, Inc.

EVS to Showcase the EVS 500 in the ITEC IBERICA Booth at MATELEC

Industry News | 2014-10-07 11:55:29.0

EVS International announces that its distributor, ITEC IBERICA KLD, will showcase the EVS 500 in Stand 4D08 at MATALEC, scheduled to take place Oct. 28-31, 2014 in Madrid, Spain.

EVS International

EVS to Showcase the New Green EVS 500LF at NEW

Industry News | 2015-03-19 17:15:46.0

EVS International will showcase the new EVS 500LF lead-free version in Booth: 108b at National Electronics Week, scheduled to take place April 21-22, 2015 at NEC Birmingham (The Pavilion Hall). With the new EVS 500LF, EVS has managed to drastically reduce the size, weight, complication and footprint, while creating a greener lead-free system.

EVS International

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