Industry News: latent defect lead free solder 2008 (Page 14 of 68)

Essemtec to Exhibit at Mexitronica 2008

Industry News | 2008-10-07 21:01:46.0

ESSEMTEC, the leading manufacturer in Mexico of surface mount technology production equipment for mid volumes, announces that it will showcase several SMT production systems at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

ESSEMTEC AG

FCT Solder and Nihon Superior USA to Showcase SN100C Solder Alloy at Electronics West 2008

Industry News | 2008-01-23 10:31:04.0

GREELEY, CO � January 21, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd, announce plans to exhibit SN100C� Lead-Free products in booth 128 at the upcoming Electronics West exhibition, scheduled to take place January 29-31, 2008 in Anaheim, Calif.

FCT ASSEMBLY, INC.

FCT Solder to Exhibit Its SN100C Products and Technologies at Mexitr�nica 2008

Industry News | 2008-10-07 21:14:49.0

GREELEY, CO � October 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will showcase its line of SN100C products and technologies with Nihon Superior Co. Ltd. in booth 402 at the upcoming Mexitr�nica exhibition scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, Mexico.

FCT ASSEMBLY, INC.

FCT Solder to Feature Its SN100C Products and Technologies at IPC Midwest 2008

Industry News | 2008-09-12 01:24:36.0

GREELEY, CO � September 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will showcase its line of SN100C products and technologies with Nihon Superior Co. Ltd. in booth 401 at the upcoming IPC Midwest exhibition and conference, scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.

FCT ASSEMBLY, INC.

Nihon Superior Paper on Lead-free Solder Properties at APEX 2008

Industry News | 2008-03-20 17:19:34.0

OSAKA, JAPAN � March 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, �Properties that are Important in a Lead-free Solder,� to the Technical Conference that is part of the Printed Circuit Expo, APEX and the Designers� Summit scheduled to take place April 1-3, 2008 at the Mandalay Bay Resort & Convention Center, Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Newly Expanded Range of SN100C Soldering Materials at Mexitr�nica 2008

Industry News | 2008-10-07 20:52:28.0

OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

Nihon Superior Co., Ltd.

Juki Automation Systems Wins a 2008 NPI Award for Its OPASS Technology

Industry News | 2008-04-07 23:18:22.0

MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.

Juki Automation Systems

Juki Automation Systems Wins 2008 SMT China Vision Award for OPASS

Industry News | 2008-04-08 23:53:03.0

MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.

Juki Automation Systems

Kester to Participate in Technical Activities During APEX 2008

Industry News | 2008-03-20 20:10:01.0

ITASCA, IL � March 2008 � Kester will provide lead-free soldering products, lead-free resources and technologies in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas. Kester will present its latest lead-free soldering products and technologies for lead-free wave, selective and hand-soldering applications.

Kester

Nihon Superior�s SN100C Wins 2008 SMT China Vision Award

Industry News | 2008-04-09 00:04:58.0

OSAKA, JAPAN � April 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded 2 2008 SMT China Vision Award with Balver Zinn in the category of Soldering Materials for its innovative SN100C Paste.

Nihon Superior Co., Ltd.


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