Industry News | 2015-01-02 09:12:06.0
ACL, Inc. introduces #8691 Mighty Mask, a fast-curing, temporary masking agent for safeguarding components during conformal coating processes and component-free areas on PCBs during soldering.
Industry News | 2008-10-29 17:30:39.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that it recently developed the CK300 - Catalyst Killer.
Industry News | 2011-05-19 21:51:24.0
Christopher Associates introduces Onstatic Technology Corp.’s (OTC) R-500 WH White LPI Solder Mask, designed specifically for LED lighting applications.
Industry News | 2008-10-29 16:47:50.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that Genesis Materials Technology (GMT) has recently dramatically improved the ENIG resistance of Florida CirTech's water-based AQ2000 LPI solder mask. AQ2000 LPI is now able to withstand the harsh chemical conditions found in the ENIG process.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
Industry News | 2008-02-04 11:15:15.0
The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.
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