Industry News | 2019-10-16 14:51:06.0
TU International, Inc. will exhibit at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. The company will showcase the Aqua Scrub flux management technology installed on the PYRAMAX ™ 125A with EPP Electronic Production Partners GmbH in Hall A3, Booth 154.
Industry News | 2012-04-13 14:02:40.0
In booth 7.203 at the upcoming SMT/Hybrid/Packaging 2012 exhibition in Nuremberg, Essemtec will present several innovations, including Scorpion, the highly flexible dispensing system, as well as two new printers for low-/mid-volume sizes.
Industry News | 2017-04-23 11:52:40.0
Microtronic GmbH today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. The ECHO™ enables package inspection of stacked dies, complex flip chips and more traditional plastic packages.
Industry News | 2013-03-27 16:56:09.0
SEHO Systems GmbH, will highlight its best-selling selective soldering system – the SEHO PowerSelective – in booth 1A67 in the German pavilion at NEPCON China 2013.
Industry News | 2013-01-15 14:50:13.0
SEHO Systems GmbH, will highlight its best-selling selective soldering system – the SEHO PowerSelective in booth #409 at the upcoming IPC APEX EXPO
Industry News | 2010-09-29 23:57:39.0
SEHO Systems GmbH, a leading worldwide soldering provider, announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Process Control – Basis for a Cost-Effective Selective Soldering Process” at the upcoming SMTA International.
Industry News | 2012-01-26 22:47:26.0
SEHO Systems GmbH announces that Christian Ott will present a paper titled “Reduction of Voids in Solder Joints: An Alternative to Vacuum Soldering” during the Voiding 1: Process and Test Technical Session on Tuesday, February 28, 2012 from 1:30-3 p.m. at the San Diego Convention Center in San Diego, CA. The paper, authored by Rolf Diehm, Mathias Nowottnick and Uwe Pape, will discuss voids in solder joins as one of the main problems for power electronics.
Industry News | 2023-10-30 19:21:14.0
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
Industry News | 2010-03-24 14:31:27.0
ERLANGER, KY - SEHO Systems GmbH, a leading worldwide soldering provider, will exhibit at the upcoming SMTA Atlanta Expo and Tech Forum, scheduled to take place Thursday, April 15, 2010 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2013-10-09 15:53:27.0
Nihon Superior Co. Ltd.will sponsor the FIRST Robotics competition at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
