Industry News: lead and free and solder and temp and for and selective and stamp and solder (Page 1 of 4)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Session 6 Agenda Is Finalized for the High-Rel Cleaning and Coating Conference Hosted by IPC and SMTA

Industry News | 2012-11-07 11:01:55.0

IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Industry News | 2010-04-10 02:05:54.0

IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Slow Growth Ahead for Economy and Electronics Industry, According to IPC

Industry News | 2013-06-12 18:27:25.0

Global economic growth is picking up, but the continuing economic crisis in the 17-nation euro area is delaying a meaningful recovery.

Association Connecting Electronics Industries (IPC)

FCT Asia Names Distributor for Hong Kong and China

Industry News | 2008-10-29 18:01:57.0

GREELEY, CO � October 2008 � FCT Assembly announces that FCT Asia has appointed Electroloy Metal to distribute the FCT assembly products including the Nihon Superior SN100 lead-free solder for sales in Hong Kong and China.

FCT ASSEMBLY, INC.

Juki and Intertec Win NPI Award for New CUBE.460 Selective Soldering System

Industry News | 2014-03-26 08:58:27.0

Juki Automation Systems (JAS), Inc.are pleased to announce that they have been awarded a 2014 NPI Award in the category of Soldering – Selective for the CUBE.460 Selective Soldering System.

Juki Automation Systems

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

Industry News | 2016-03-29 13:24:40.0

FCT Assembly (www.fctassembly.com), a leader in the development and manufacturing of high performance solders and advanced fluxes; has formulated a unique halogen-free water soluble flux with high activity and neutral pH. FCT’s 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys.

FCT ASSEMBLY, INC.

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

Industry News | 2016-03-30 08:19:13.0

FCT Assembly has formulated a unique halogen-free water soluble flux with high activity and neutral pH. FCT's 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys. With the low solids content of 159HF, the water soluble flux is applicable in selective; drop-jet spray soldering applications while also being ideal for wave soldering. Because the flux stays active under critical temperatures during pre-heat and wave, 159HF performs exceptionally well in high temperature applications, especially with manufacturers using multilayer boards with lots of heat sink resulting in improved topside fill.

FCT ASSEMBLY, INC.

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