Industry News: lead with lead free components (Page 7 of 203)

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

MIRTEC to Exhibit its Complete Line of AI-Based SMT and Automotive Pin Inspection Solutions at Productronica 2021

Industry News | 2021-10-11 16:13:11.0

MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.

MIRTEC Corp

SMT Placement Machine Nozzle Maintenance and Operation Instructions from KINGSUN

Industry News | 2023-08-18 12:40:11.0

"DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" is a leading SMT automation equipment factory provider in China. With many years of profound experience accumulation, we provides comprehensive solutions for global customers with strong resources and high-quality professional technical team.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Bangkok Events to Focus on Solderability, Assembly and Reliability Workshop and free technical conference scheduled for November

Industry News | 2013-10-01 18:16:06.0

A dozen experts from organizations in Asia, Europe and North America will present strategies for enhancing reliability in electronics assemblies on 19–20 November in Bangkok.

Association Connecting Electronics Industries (IPC)

Preventing the Big 7 Mistakes of SMT Electronics Assembly with Expert Phil Zarrow

Industry News | 2016-10-20 19:39:17.0

The Philadelphia branch of the Surface Mount Technology Association (SMTA Philly) is kicking things off with a meeting on Thursday, November 10, 2016 at 3 p.m. at the Crowne Plaza Bucks County in Trevose, PA.

Surface Mount Technology Association (SMTA)

Preventing the Big 7 Mistakes of SMT Electronics Assembly with Expert Phil Zarrow

Industry News | 2016-10-20 19:39:18.0

The Philadelphia branch of the Surface Mount Technology Association (SMTA Philly) is kicking things off with a meeting on Thursday, November 10, 2016 at 3 p.m. at the Crowne Plaza Bucks County in Trevose, PA.

Surface Mount Technology Association (SMTA)

Reading the Fine-Pitch — IPC-7525 Updated to Deal with New Materials

Industry News | 2012-06-09 14:33:06.0

To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.

Association Connecting Electronics Industries (IPC)

Count On Tools Inc. Introduces Cross-handle Screwdrivers with Lateral Drive from PB Swiss Tools

Industry News | 2015-03-03 13:05:52.0

Count On Tools now carries PB Swiss Tools’ Cross-handle Screwdriver. The ergonomic two-component cross-handle with a sheathing made of high-quality Santoprene® fits perfectly in the hand and allows fatigue-free working. The lateral drive ensures the required force transfer while tightening or loosening the screws.

Count On Tools, Inc.

IPC Offers Technical Education Course, Designing Boards with HDI Technology, at PCB Carolina

Industry News | 2018-07-10 20:52:09.0

High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.

Association Connecting Electronics Industries (IPC)


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