Industry News: lead-free alloys (Page 12 of 69)

FCT Solder to Focus on Lead-Free Projects and Questions with SN100C® Lead-Free Alloy at Productronica 2009

Industry News | 2009-12-07 18:49:39.0

GREELEY, CO — September, 2009 - FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.’s SN100C product line, announces plans to exhibit its popular SN100C® Lead-Free Solder Paste, Bar and Wire and UltraSlic™ FG solder paste stencil in Hall A4 Stand 570 of the upcoming Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

FCT ASSEMBLY, INC.

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Industry News | 2016-08-30 15:31:51.0

Nihon Superior Co. will exhibit in Booth #418 at SMTA International, scheduled to take place September 27-28, 2016 at Donald Stephens Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Industry News | 2017-01-10 08:37:14.0

Nihon Superior will exhibit in Booth #2610 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.

Nihon Superior to introduce TipSave N flux-cored solder at NEPCON Asia

Industry News | 2019-08-17 11:50:22.0

OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.

Nihon Superior Co., Ltd.

FCT Assembly Receives Appreciation Award from Nihon Superior Co. Ltd.

Industry News | 2011-04-29 21:09:25.0

FCT Assembly announces that it received an appreciation award during a dinner ceremony hosted by Nihon Superior Co. Ltd. on Wednesday, April 13, 2011 during the IPC APEX EXPO in Las Vegas.

FCT ASSEMBLY, INC.

AIM to Showcase NC259 Solder Paste at IPC Midwest

Industry News | 2012-07-25 10:17:38.0

AIM, will highlight its new NC259 Solder Paste

AIM Solder

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

Industry News | 2012-09-13 14:02:26.0

AIMannounces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo,

AIM Solder

FCT Assembly’s Sergio Juarez Offered Helpful Tips for Lead-Free Soldering during the SMTA Austin Expo and Tech Forum

Industry News | 2012-09-27 18:49:03.0

FCT Assembly announces that Sergio Juarez, Sales Manager Mexico & C.A., held a successful presentation at the recent SMTA Austin (CTEA) Expo

FCT ASSEMBLY, INC.

Nihon Superior to Present at the TMS 2008 Annual Meeting and Exposition

Industry News | 2008-03-05 22:38:31.0

OSAKA, JAPAN � March 5, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled �High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys� authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.

Nihon Superior Co., Ltd.

Indium Corporation Technology Experts Presenting at IMAPS New England

Industry News | 2011-04-27 20:09:26.0

Two of Indium Corporation's technology experts will present their technical findings at IMAPS New England in Boxboro, MA, May 3, 2011.

Indium Corporation


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