Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Industry News | 2018-09-18 20:11:02.0
Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2016-07-10 12:08:40.0
All our training workshops are run on site at your manufacturing facility, conference or exhibition venues worldwide. We offer the largest range of topics in the industry
Industry News | 2020-12-10 17:23:10.0
Indium Corporation's Dr. Hong Wen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the IEEE Electronics Packaging Society (EPS) Malaysia Chapter Webinar Series at 9 a.m. Malaysia Time, Wednesday, Dec. 16 (8 p.m. Eastern Time, Tuesday, Dec. 15).
Industry News | 2008-02-11 15:49:48.0
GREELEY, CO � February 8, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.�s SN100C product line, announces the NC162 SN100C� No-Clean Flux.
Industry News | 2022-11-15 12:50:53.0
Nihon Superior Co. Ltd. is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2 is the high-strength alloy of choice when cracking minimization is a key selection criterion.
Industry News | 2021-08-13 08:37:00.0
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.
Industry News | 2011-10-16 00:20:48.0
Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.
Industry News | 2015-12-28 17:22:37.0
Nihon Superior will exhibit in East Hall 1 E3-18 at NEPCON Japan, scheduled to take place Jan. 13-15, 2016 at the Tokyo Big Site in Japan. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Industry News | 2003-02-28 08:22:47.0
Dr. Zhang will lead the global R&D and product formulation activities of the company's tin, tin alloy and lead-free technologies.
