Industry News | 2012-11-07 11:01:55.0
IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2014-05-12 16:06:39.0
SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2018-03-01 19:13:43.0
In recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry, Dave Hillman, Rockwell Collins, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, February 27 at the San Diego Convention Center. IPC’s most prestigious award, the Hall of Fame is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Industry News | 2015-01-07 15:52:18.0
The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2011-02-09 14:50:49.0
Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Industry News | 2011-02-19 18:32:03.0
From a record number of technical abstract submissions, the best papers in PCB and electronics manufacturing and assembly were selected for presentation at the IPC APEX EXPO™ Technical Conference, April 12–14, 2011 in Las Vegas. Featuring new research and innovations from industry experts around the world, the IPC APEX EXPO Technical Conference will cover more than 30 technical topics to provide the industry with practical solutions and new opportunities for the future.
Industry News | 2016-04-29 11:38:38.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.
Industry News | 2016-07-02 06:45:13.0
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.
