Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Industry News | 2011-01-07 10:56:12.0
The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2011 International Conference on Soldering and Reliability being held this May 4-6, 2011 in Toronto, Ontario, Canada. Abstracts are due by January 28, 2011.
Industry News | 2022-10-24 08:01:58.0
I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that deliver high reliability. We also stand ready to work with customers in developing improved soldering materials and processes.Our objective is maximizing customer satisfaction by achieving the best possible quality and yield.
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2008-05-03 17:23:25.0
MINNEAPOLIS, MN � The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai. The conference will be held at Disney's Coronado Springs Resort and Convention Center in Orlando, Florida on August 17 - 21. This year�s program allows the attendee to choose from 24 courses, 100 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.
Industry News | 2008-05-03 16:37:13.0
MINNEAPOLIS, MN � The SMTA is pleased to announce that the program for their 21st annual conference, SMTA International, is finalized and available on-line at www.smta.org/smtai.
Industry News | 2008-12-15 16:20:40.0
Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.
Industry News | 2003-05-06 08:21:44.0
Will address key issues in the
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
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