Industry News: leadframe process using flux (Page 10 of 96)

AIM's Karl Seelig to Present During Technical Session on Flux at IPC APEX EXPO 2012

Industry News | 2012-01-26 22:30:21.0

AIM announces that Karl Seelig, Vice President of Technology, will present his VOC-Free Flux Study during a technical session entitled Flux.

AIM Solder

YINCAE's Fully Flux Residue Compatible Underfill: UF 158HA

Industry News | 2022-08-16 16:11:50.0

YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill. Using UF 158HA can eliminate cleaning process and pollution from the cleaning process, and simplify the manufacturing process.

YINCAE Advanced Materials, LLC.

Cobar Solder Products to Exhibit High Performance Fluxes at the 2011 Pan Pacific Microelectronics Symposium

Industry News | 2011-01-12 14:24:53.0

The Balver Zinn Group announces that Cobar Europe BV will exhibit a completely new range of high-performance low-VOC and VOC-free fluxes at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 18-20, 2011at the Hapuna Beach Prince Hotel on the Big Island of Hawaii.

Cobar Solder Products Inc.

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-28 12:23:26.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

ASM Assembly Systems (DEK)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-30 21:06:08.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

Henkel Electronic Materials

SHENMAO wins Global Technology Award for SM-862 Liquid Flux

Industry News | 2018-10-17 20:13:20.0

SHENMAO America, Inc. is pleased to announce that it was awarded a 2018 Global Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.

Shenmao Technology Inc.

SHENMAO Picks up Third Award for New Liquid Flux

Industry News | 2019-01-30 08:42:31.0

SHENMAO America, Inc. is pleased to announce that it was awarded a 2019 NPI Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Shenmao Technology Inc.

SHENMAO Launches the SMF-UL51 Ultra-Low-Residue Flux for No-Clean Packaging Processes

Industry News | 2018-09-26 11:50:32.0

SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Shenmao Technology Inc.

BTU to Showcase HE Flux Management for the PYRAMAX™ Solder Reflow Oven at IPC APEX 2012

Industry News | 2012-01-19 23:27:14.0

BTU International will highlight its next-generation High Efficiency (HE) Flux Management and new dual-lane, dual-speed capabilities of the PYRAMAX™ solder reflow system in Booth #3409 at the upcoming IPC APEX Expo.

BTU International

Balver Zinn Group’s Area Sales Manager to Present at IPC Standard Workshop in Russia

Industry News | 2014-08-25 21:13:55.0

The Balver Zinn Group announces that Han Raetsen, Area Sales & Support Manager, will present at the IPC Standard and Electronic Manufacturing workshop and seminar. Raetsen will present, "Mixed Technology: The impact of using a SnPb soldering material in combination with Pb-free components", and "Reliability of Fluxes in Selective Soldering Applications."

Cobar Solder Products Inc.


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