Industry News | 2011-01-31 22:13:54.0
Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for CREE® XLamp® XM-L LED components. The new series is manufacturer-approved, based on CREE Inc.’s strict requirements and specifications.
Industry News | 2013-10-11 08:17:05.0
Count On Tools Inc. (COT), is pleased to announce that it has been invited to take part in the Cree Solution Provider Program (CSP).
Industry News | 2010-05-11 11:59:56.0
GAINESVILLE, GA - Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its new series of custom SMT pick-and-place nozzles for CREE® LED components. This new series is manufacturer-approved, based on CREE Inc.'s strict requirements and specifications.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2015-11-12 21:24:58.0
KYZEN is pleased to announce that it will present at the LED A.R.T. Symposium, scheduled to take place Nov. 17-19, 2015 at the Crowne Plaza Midtown in Atlanta, GA. Dr. Mike Bixenman will present the paper titled “LED Failure Mechanisms That Can be Linked to Post Assembly Cleaning.”
Industry News | 2017-10-17 20:32:02.0
Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.
Industry News | 2011-08-03 21:32:16.0
Cognex Corporation has introduced its next-generation wafer identification (ID) reader and accompanying software, the In-Sight® 1740 series and In-Sight Explorer Wafer ID software version 4.5.0.
Industry News | 2010-08-09 12:58:18.0
The 16th edition of NEPCON South China will take place at the Shenzhen Convention and Exhibition Center from August 31-September 2, 2010. Josephine Lee, Vice President of Reed Exhibitions East China ― one of the organizers of the exhibition ― believes that there will be numerous market-redefining electronics manufacturing products and technologies from around the globe at the show.
Industry News | 2003-05-13 11:56:58.0
Brian Hodges, a 12-year veteran of the semiconductor industry and former executive at Intersil Corporation, has joined Anadigm�, Inc. as vice president of worldwide marketing.
Industry News | 2020-12-23 19:03:03.0
Cornell Dubilier 3- and 6-volt Capacitors Offer Greater Power and Energy Density than Typical 2.7Vdc Parts
