Industry News: led pairing (Page 1 of 2)

Nordson Electronics Solutions wins Global Technology award for the ASYMTEK Select Coat SL-1040 Conformal Coating System

Industry News | 2024-11-04 15:16:00.0

The SL-1040 pairs new process control and new maintenance features, ideal for conformal coating in high-volume electronics manufacturing

Nordson Electronics Solutions

Two-sided LED placement - Saving time and placement cost with SIPLACE LED Pairing

Industry News | 2013-01-17 14:44:18.0

With its LED Pairing feature, the SIPLACE team of ASM Assembly Systems had already simplified the complex LED placement process significantly by automating the time-consuming management of different brightness classes and matching resistors. Now the company’s engineers have advanced this successful principle even further: With the new SIPLACE LED Pairing process, LEDs and their associated resistors can now be selected and placed on both sides of the circuit board.

ASM Assembly Systems GmbH & Co. KG

ASM Assembly Systems at the SMT Hybrid Packaging 2013 show

Industry News | 2013-03-12 13:42:20.0

With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.

ASM Assembly Systems GmbH & Co. KG

SIPLACE at the 2013 APEX show SIPLACE software combined with flexible hardware makes all the difference

Industry News | 2013-01-30 17:37:16.0

After a record year, the SIPLACE team of ASM Assembly Systems wants to keep expanding its market position in North and South America

ASM Assembly Systems GmbH & Co. KG

Juki Announces the Shipment of its 7500th KE2050/2060 Machine

Industry News | 2009-10-13 12:50:18.0

MORRISVILLE, NC - October 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, is pleased to announce the shipment of the 7500th KE2050/2060 machine from its manufacturing complex in Akita, Japan. The KE2050/2060 series is the all time best selling placement machine model in Juki history, and also the best selling placement machine of all time.

Juki Automation Systems

BTU to Show PYRAMAX and Profile Guardian at NEPCON China

Industry News | 2018-03-29 20:34:39.0

BTU International will exhibit at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the Profile Guardian Redundant Process Monitor and PYRAMAX™ 125N Reflow Oven in Stand 1F25.

BTU International

BTU International to Showcase Reflow Oven with Redundant Process Monitor

Industry News | 2019-08-13 06:39:49.0

BTU International today announced that it will exhibit at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will demonstrate a PYRAMAX 150A 12-zone reflow oven with the Profile Guardian Redundant Process Monitor in Hall 1, Booth 1M45.

BTU International

New KD9351 FOT Reduces Cost for Gigabit Connectivity

Industry News | 2021-03-10 09:16:05.0

KDPOF Provides Efficient Optical Technology for Safe Backbone and ADAS Sensor Links in Vehicles

KD

New Low-Temperature Solder Paste from SHENMAO

Industry News | 2018-06-17 16:55:59.0

SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Shenmao Technology Inc.

Essemtec Wins NPI Award for Tarantula All Terrain Jet Dispenser

Industry News | 2018-02-28 08:22:00.0

Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

ESSEMTEC AG

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