Industry News: length of terminal (Page 11 of 12)

AUTOTESTCON will see the Launch of New Switching Solutions and Software from Pickering Interfaces

Industry News | 2016-09-07 19:24:27.0

Pickering Interfaces will be showcasing their latest PXI & LXI switching and simulation solutions and software at AUTOTESTCON – September 12-15, 2016. These new products include:

Pickering Interfaces Ltd.

Flynn Systems appoints Kontest as Scandinavian representative of onTAP (JTAG) Boundary Scan Software for PCB board design and test

Industry News | 2003-05-08 12:23:31.0

Highly respected Swedish test technology firm is widely regarded for strong customer support and boundary scan experience.

Flynn Systems

QUALCOMM Congratulates KDDI on Launch of Third-Generation CDMA Services in Japan

Industry News | 2002-04-02 08:08:59.0

Latest 3G CDMA2000 1X Launch is World's First to Provide National Position Location Deployment

Qualcomm Personal Electronics

NEPCON & Smart Factory 1.0 - The Future of Electronics Manufacturing

Industry News | 2015-03-31 19:03:44.0

The electronics manufacturing automation trend, as seen in robotics, motion control, automation equipment/accessories, transmission, tools, assembly and materials, is a key industry highlight, transforming electronics manufacturing by encouraging ongoing restructuring. NEPCON China 2014 introduced new equipment and technologies in its EMA zone, demonstrating how, robotics are replacing manual labor. This year, at the Shanghai Expo Center, NEPCON China 2015 will again focus on electronics manufacturing automation, while highlighting automation system integration, a step beyond mere hardware equipment.

Reed Exhibitions

Koh Young Technology is Showing its Award-winning Suite of True 3D Inspection Solutions at NEPCON China

Industry News | 2021-04-21 10:17:09.0

Seoul, South Korea – At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.

Koh Young America, Inc.

Koh Young Technology is Showing its Award-winning Suite of True 3D Inspection Solutions at NEPCON China

Industry News | 2021-04-29 16:58:08.0

At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.

Koh Young America, Inc.

PRIDE Industries Adds New Inspection Capability with the Purchase of A XD7600NT Ruby FP from Nordson DAGE

Industry News | 2012-05-17 09:51:56.0

PRIDE Industries, Inc., recently purchased an XD7600NT Ruby FP X-ray inspection system from Nordson DAGE.

Nordson DAGE

SolderStar Selects its Range of Advanced Thermal Profiling Solutions to be Exhibited at SMT Hybrid Packaging Hall 7 Stand 516

Industry News | 2015-03-07 18:35:19.0

SolderStar Ltd, a world leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, will be highlighting a number of innovative products, including its latest advancement in selective soldering, at SMT Hybrid Packaging in Nuremberg, Germany from 5 – 7th May 2015.

Solderstar

Methode Electronics, Inc. Acquires Power Connector Business -- Acquisition of Tribotek, Inc.'s Assets Expands Methode's Presence in Power Distribution --

Industry News | 2008-03-14 18:52:49.0

Methode Electronics, Inc. (NYSE: MEI), a global manufacturer of electronic components and subsystem devices, recently announced that it has acquired the business assets of Tribotek, Inc., a Burlington, Mass.-based technology company.

Methode Electronics, Inc.

Additive Circuits, Inc. Makes BGA Modification Break-through, Adds New Conductors

Industry News | 2007-12-06 11:45:48.0

Solid Copper Conductors are Added Between BGA Pads

Additive Circuits, Inc.


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