Industry News | 2009-11-04 15:38:32.0
The SMART platform offers a test solution for low to mid volume PCB assemblies without high tooling costs.
Industry News | 2010-07-16 16:12:26.0
Krayden, Inc., a leading distributor of engineered materials, announces that it received the Dow Corning Electronics 2009 Distributor of the Year award during a ceremony that was held on May 19, 2010 at its headquarters in Denver. This is the second consecutive year Krayden, Inc. has earned this award.
Industry News | 2011-02-21 17:44:33.0
Krayden, Inc., a leading distributor of engineered materials, announces that the Dow Corning Americas Electronics Channel Team named Krayden, Inc. as the recipient of the Distributor of the Year Award.
Industry News | 2011-04-20 20:31:30.0
FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.
Industry News | 2011-11-08 14:17:32.0
Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
Industry News | 2012-10-29 11:00:37.0
Murata in collaboration with Cogiscan Inc., announce a new strategic partnership. The companies have combined their respective products to offer complete PCB track, trace and control solutions using Murata’s innovative RFID tag — MAGICSTRAP®.
Industry News | 2021-10-28 11:44:57.0
Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKSTM heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications.
Industry News | 2022-03-09 12:37:18.0
Pin and Slant Fin Heat Sinks Offer Economical Electronics Cooling
Industry News | 2018-05-03 11:19:15.0
Pickering Interfaces announced that the U.S. Air Force, Ogden Air Logistics Complex at Hill AFB, Utah, recently awarded them a contract for a large quantity of their 6U High-Density Matrix modules (model 45-542) for the PXI switching requirement that is part of the PATS-70A (Portable Automated Test Set) for the O-Level and I-Level maintenance of A-10C aircraft.