Industry News | 2022-12-26 11:44:31.0
The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California.
Industry News | 2009-07-24 14:13:44.0
Minneapolis, MN – The SMTA and MEPTEC are proud to announce the program for their co-organized 2009 Medical Electronics Symposium: Drivers for Technology, Health and the Economy on September 16-17, 2009 at Arizona State University, Tempe, AZ. This two day program will cover a broad spectrum of medical applications with Day 1 focusing primarily on the chip level component packaging and Day 2 focusing on board assembly and systems levels.
Industry News | 2019-07-16 19:36:51.0
The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 22-24, 2019 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2021-08-13 12:11:05.0
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.
Industry News | 2019-10-16 11:15:35.0
Precision PCB Services, Inc. will Exhibit at the International Wafer-Level Packaging Conference Exhibition on October 23 - 24, 2019 at the Double Tree Hotel, 2050 Gateway Place, San Jose, CA
Industry News | 2010-02-01 13:36:36.0
Minneapolis, MN - The SMTA, in conjunction with Chip Scale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the Marriott Santa Clara Hotel in Santa Clara, CA. The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program on or before April 23, 2010.
Industry News | 2010-06-28 16:44:36.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Registration is now available on-line. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.
Industry News | 2011-07-20 14:49:09.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 8th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Industry News | 2008-11-14 11:24:40.0
San Jose, CA � The 5th Annual International Wafer-Level Packaging Conference ended 2008 with success, bringing in its highest attendance yet.
