Industry News: lga rework (Page 1 of 5)

SMTA China Presents Awards at SMTA China East 2011

Industry News | 2011-05-16 16:53:28.0

SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.

Surface Mount Technology Association (SMTA)

SMTA South East Asia Technical Conference on Electronics Assembly Technologies Call for Presentations Announced

Industry News | 2009-04-23 20:54:01.0

MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:

Surface Mount Technology Association (SMTA)

Gaining a Competitive Edge in Eastern Europe’s Fast-growing Electronics Assembly Market

Industry News | 2012-10-16 18:56:39.0

IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.

Association Connecting Electronics Industries (IPC)

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Industry News | 2017-09-19 17:02:13.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Dieg

Industry News | 2018-02-12 10:15:49.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2019 in San Diego

Industry News | 2018-08-06 20:44:43.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego

Industry News | 2016-09-22 17:27:09.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

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