Industry News: lid (Page 1 of 4)

Depaneling Saws for Low Stress PCB Singulation

Industry News | 2020-07-01 12:08:16.0

For high precision low stress PCB singulation of panels with sensitive components near the parting edge, and with the smooth edge finish required by military specifications or by packaging considerations, using a Diamond Blade Saw beats routing for speed and for blade life. The saw blade, a 2.95" (75mm) diameter .021" thick diamond coated cutting disk, provides a low-stress, ultra smooth edge finish for separting panelized Printed Circuit Cards. ts which overhang the parting line will remain intact.

FKN Systek

XYZTEC makes lid pull easy

Industry News | 2016-09-30 05:38:43.0

In this newsletter we describe a new method of testing the seal and adhesive quality of a lid encapsulated devices.

XYZTEC bv

StratEdge Semiconductor Packages Now Sold on Amazon.com

Industry News | 2017-05-03 21:11:11.0

StratEdge Corporation announces the opening of its Amazon Store to sell its off-the-shelf high-frequency packages.

StratEdge Corporation

ATE Spring Pin BGA Socket for Digital Camera Processor

Industry News | 2011-01-12 15:27:11.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.

Ironwood Electronics

Techcon Systems Debuts TS1254 Pressure Pot

Industry News | 2010-11-24 13:42:19.0

Techcon Systems introduces the new TS1254 Pressure Pot. The new mid-sized pressure pot is designed to accommodate low to medium viscosity fluids, including solvents, adhesives and Cyanoacrylate (CA).

Techcon Systems

Elastomer Socket for Infineon's BGA221

Industry News | 2011-03-11 14:47:03.0

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.4mm pitch 221 ball BGA - SG-BGA7162. The socket operates at bandwidths up to 10 GHz with less than 1dB of insertion loss.

Ironwood Electronics

Vincotech’s One-Step Mounting Technology – Fast, Reliable, Flexible

Industry News | 2012-06-29 08:09:26.0

Aiming to cut assembly costs and avert inverter assembly flaws, several companies now offer power modules that can be mounted in a single step. Some use housings with a hole in the middle and a lid to hold the PCB, module and heat sink in place.

Vincotech

Barry Industries Introduces Hermetically Sealable HTCC Air-Cavity Quad-Flat-No-Lead (QFN) Packages to 40GHz

Industry News | 2013-11-14 18:35:01.0

Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.

Barry Industries, Inc.

Spring Pin Socket for Kelvin Resistance Measurement

Industry News | 2010-12-10 12:27:00.0

Ironwood Electronics recently introduced a new spring pin socket addressing precise resistance measurement need for testing power management devices - SSK-QFN-7000.

Ironwood Electronics

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