Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2017-09-30 08:07:56.0
BTU International will exhibit in Booth #311 at IMAPS Raleigh, scheduled to take place Oct. 10-12, 2017 at the Raleigh Convention Center in NC. BTU will showcase its PYRAMAX™ reflow ovens and high-temperature belt furnaces.
Industry News | 2021-01-30 07:00:01.0
MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.
Industry News | 2021-11-22 06:40:32.0
Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.
Industry News | 2004-09-27 17:12:27.0
High-Resolution X-Ray Inspection Under $60K
Industry News | 2021-03-30 11:44:23.0
Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.
Industry News | 2003-02-14 08:03:50.0
Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans
Industry News | 2004-10-01 12:15:58.0
Verifer HR High-Resolution X-Ray Inspection Solution Under $60K
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