Industry News: lines can (Page 9 of 383)

The Smart Factory is Becoming a Reality as IPC APEX EXPO 2019 Hosts Two Live Production Lines Collaboration between IPC CFX and HERMES Standards to be highlighted

Industry News | 2018-12-11 19:12:27.0

Creating the next generation of digital Industry 4.0 technology standards, IPC will again take a major step forward at IPC APEX EXPO 2019, featuring two live production lines, at which visitors can see and experience achievements made in digital standards development over the past year.

Association Connecting Electronics Industries (IPC)

IPC-9203 Makes it Easier for Users to Determine Materials Compatibility

Industry News | 2012-04-30 14:28:32.0

The job of testing or demonstrating materials and process compatibility just became easier with the newly released IPC-9203,

Association Connecting Electronics Industries (IPC)

IPC’s Connected Factory Initiative Subcommittee Vote Finalizes the Connected Factory Exchange (CFX) Standard

Industry News | 2019-01-22 12:08:49.0

IPC announces unanimous ballot approval of IPC-2591, Connected Factory Exchange (CFX) by the 2-17 Connected Factory Initiative Subcommittee. The electronics industry now has an industry standard it can use to quickly and easily implement Industry 4.0 in its manufacturing operations. IPC plans to release this free and open standard to industry in the weeks ahead.

Association Connecting Electronics Industries (IPC)

Web-based Seminar on Black Pad to Feature Solectron Tech Leaders

Industry News | 2003-03-14 08:18:03.0

The instruction is intended as a practical user's guide for determining if a failure is related to black pad.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

ASYMTEK Products | Nordson Electronics Solutions

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Design Decisions That Reduce Manufacturing Costs

Industry News | 2018-10-18 10:06:45.0

Design Decisions That Reduce Manufacturing Costs

Flason Electronic Co.,limited

IPC Releases IPC-2591, Connected Factory Exchange (CFX) Industry standard allows for quick and easy implementation of Industry 4.0 applications

Industry News | 2019-04-23 07:43:52.0

IPC announces the release of IPC-2591, Connected Factory Exchange (CFX). The electronics industry now has an industry standard available to all companies in the industry, regardless of size or location which can be used to quickly and easily implement “Industry 4.0” and “smart factory” applications to their manufacturing operations.

Association Connecting Electronics Industries (IPC)

Precision PCB Services, Inc. Adds New Line of Rework Products

Industry News | 2010-07-15 14:19:11.0

Now an authorized distributor for Chip Quik products.

Precision PCB Services, Inc


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