Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
Industry News | 2022-12-07 03:45:24.0
X-Ray SMD component Counting machine is also called X-ray SMT Counter, SMT Automatic X-ray counting machine, Intelligent SMT automatic Counter, Automatic X-ray counter etc.
Industry News | 2023-04-03 13:50:54.0
IPC Issues March Economic Outlook Report
Industry News | 2024-01-16 03:45:38.0
Discover efficiency with I.C.T's Intelligent SMD Storage. Streamline processes, optimize space, and elevate SMT production globally. Explore now!
Industry News | 2008-05-03 16:37:13.0
MINNEAPOLIS, MN � The SMTA is pleased to announce that the program for their 21st annual conference, SMTA International, is finalized and available on-line at www.smta.org/smtai.
Industry News | 2008-05-03 17:23:25.0
MINNEAPOLIS, MN � The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai. The conference will be held at Disney's Coronado Springs Resort and Convention Center in Orlando, Florida on August 17 - 21. This year�s program allows the attendee to choose from 24 courses, 100 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.
Industry News | 2009-06-10 10:17:32.0
The best place to buy SMT Nozzles just got even better. New interactive online catalog!
Industry News | 2010-05-20 12:47:37.0
GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2014-03-26 12:35:36.0
Count On Tools Inc. (COT) announces that it has been awarded a 2014 NPI Award in the category of Automation Tools for its StripFeeder Modular (.mod) System version 2.
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