Industry News | 2019-01-12 07:42:28.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Industry News | 2013-03-13 13:43:59.0
Formulated to address the limitations of alternative products, Henkel Electronic Materials announces the commercial availability of two encapsulants for selective protection of environmentally-susceptible components. The materials, LOCTITE ECCOBOND UV9060F and LOCTITE ECCOBOND EN 3707F, deliver an impermeable barrier to potential environmental influences and offer manufacturers cure process flexibility and deposition traceability.
Industry News | 2002-03-13 07:31:38.0
Loctite Corp. has been named a recipient of Intel Corp.'s (Chandler, AZ) 2001 Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance by suppliers providing products and services deemed essential to Intel's success. The company was recognized for its efforts in supplying Intel with die attach adhesives and underfill materials. All SCQI award winners will be honored at a celebration in Burlingame, CA on March 13, 2002.
Industry News | 2008-04-10 21:33:27.0
Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas.
Industry News | 2012-04-27 19:07:14.0
Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2011-11-01 19:36:58.0
Krayden has received an Outstanding Teamwork 2011 Award from Henkel Technologies. The award reiterates Krayden’s ongoing dedication to world-class customer services.
Industry News | 2017-01-24 17:10:51.0
At next month’s IPC APEX Expo (APEX) event in San Diego, California, Henkel Adhesive Technologies’ electronics business will display a full range of state-of-the-art electronic materials, all designed to push the conventional limits of performance capability. From February 14 through 16 in booth #1501, Henkel’s line of game-changing solder, encapsulant, underfill and thermal materials will be on show.
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