Industry News: low dk glass (Page 3 of 12)

KDPOF Celebrates IEEE 802.3cz-2023 Standard for Automotive Multi-gigabit Ethernet over Fiber Optics

Industry News | 2023-06-07 09:02:31.0

New standard defines Physical Layer specifications and management parameters for multi-gigabit glass optical fiber automotive Ethernet

KDPOF

Engineered Material Systems Debuts Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications

Industry News | 2014-02-11 15:25:57.0

Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Automotive: KDPOF and Würth Elektronik Cooperate for Optical Multi-gigabit Ethernet

Industry News | 2023-03-01 13:01:44.0

Presentation of Next-generation High-speed Connectivity up to 50 Gb/s over Glass Optical Fiber for ADAS and Connected Driving

KDPOF

Sono-Tek to Highlight Cost Effective Alternative to Vapor Deposition, Producing Precision Anti-Reflection Coatings for Solar Glass Manufacturing

Industry News | 2010-08-04 22:07:04.0

Sono-Tek Corporation, a US-based company specializing in ultrasonic equipment used for alternative energy product manufacturing, will highlight its ultrasonic coating equipment, including a high-speed ultrasonic reciprocating coating system, HyperSonic, in Hall 4/Level 2/A45 at the 25th EU PVSEC in Valencia, Spain from 6-9 September 2010.

SONO-TEK CORPORATION

Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications

Industry News | 2013-10-22 14:45:08.0

Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost, Snap Cure Conductive Adhesive for Die Attach Applications

Industry News | 2014-01-07 18:42:22.0

Engineered Material Systems debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

CeTaQ Now Offers Accuracy Validation of AOI Systems

Industry News | 2008-10-15 23:56:47.0

BEDFORD, NH � October 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that it offers accuracy of automated optical inspection (AOI) systems.

CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)

Isola Expands Production of GETEK Materials in Germany to Support European OEMs

Industry News | 2014-02-18 10:31:01.0

Isola Group S.à r.l. announced today that GETEK® laminates and prepegs are now in production at its facility in Düren, Germany, which will shorten lead times to Isola's European customers.

Isola Group

A New Low-Cost Conductive LED Die Attach Adhesive Is Now Available for Small Die and LEDs

Industry News | 2013-04-29 12:50:23.0

Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.


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