Industry News | 2015-09-03 16:37:18.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2015 Conference Award Presentation Ceremony, held on Tuesday, August 25, 2015 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2018-01-31 17:46:49.0
The SMTA Capital Chapter is pleased to announce that it will host a Chapter Tutorial Program on March 15th from 9AM to 3PM in Rockville, MD. Phil Zarrow, ITM consulting, will present “Understanding and Implementing Best Practices in Electronic Assembly Processes”.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2023-07-22 07:16:28.0
Exceptional Semi-Auto SMT LED Production Line Delivered by Denmark Partner. Witness the power of advanced technology and expertise as our Denmark partner brings you a seamless, high-performing production line. Elevate your LED manufacturing capabilities, optimize efficiency, and stay ahead in the industry with our top-notch solutions today
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
