Industry News | 2010-04-11 01:31:51.0
MARTIN, a FINETECH company, announces that it has been awarded a 2010 SMT VISION Award in the category of Rework and Repair for its Expert 10.6XL Rework System. The award was presented to the company during a Monday, April 5, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2010.
Industry News | 2012-06-04 11:39:23.0
MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.
Industry News | 2012-01-20 15:45:47.0
MARTIN will showcase its MINIOVEN Reball/Prebump unit, Expert 10.6 rework system and Clever Dispense unit at the upcoming IPC APEX Expo.
Industry News | 2010-10-01 01:05:06.0
Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2013-11-27 15:30:07.0
Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2022-04-13 09:47:35.0
MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, "Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?" on April 19 at 10:30 am New York / 3:30 pm London.
Industry News | 2011-08-01 16:57:15.0
Quicktronics PCB & Electronics Service GmbH, German outsourcing partner in the field of printed circuit boards, announce the opening of an office in Poland. This new subsidiary will help Quicktronics clients in Northeastern Europe to benefit more rapidly and more efficiently from Quicktronics' competence.
Industry News | 2012-11-29 13:46:02.0
In October, Universal Instruments Corporation’s Advanced Process Lab (APL) held its third Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2012 at Binghamton University’s Innovative Technologies Complex in Vestal, N.Y. The 25-member consortium, organized by Universal, helps member organizations identify and develop new and emerging technologies, generating applicable knowledge for specific product development and manufacturing processes.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
