Industry News: martin qfn rework station (Page 1 of 5)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

Manncorp's APEX 'Show Stoppers' to Feature Special Savings plus New Rework Systems

Industry News | 2009-03-09 20:31:03.0

Taking aim squarely at the weakened economy, Manncorp has announced substantially lower prices during APEX on two of its best-selling pick and place machines. The company will also unveil three rework stations designed to save time and dollars by reclaiming components and assemblies in-house that might have been previously discarded or sent to outside repair specialists.

Manncorp

PDR Showcases Advanced QFN Rework Capabilities with Focused IR Technology

Industry News | 2024-11-04 15:07:11.0

PDR Americas is excited to spotlight its cutting-edge QFN Rework solutions. Utilizing the advanced PDR IR E3 Rework Station, PDR offers a hassle-free and precise process for QFN rework, ensuring the highest quality standards in electronic assembly and repair.

PDR-America

Manncorp's APEX 'Show Special' Savings Continue Through April 30

Industry News | 2009-04-15 22:29:22.0

Manncorp has announced post-Apex continuation, through April 30, of substantially lower prices on two of its best-selling pick and place machines.

Manncorp

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Upper Midwest

Industry News | 2010-05-29 18:57:32.0

MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Ohio Valley Expo & Tech Forum

Industry News | 2010-06-30 12:09:49.0

MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Industry News | 2012-09-26 07:31:28.0

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,

Finetech

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Industry News | 2010-09-15 21:55:19.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

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