Industry News: martin reballing (Page 1 of 4)

IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference to Present “Research Methods for Mitigating Field Failures” Session

Industry News | 2014-10-12 19:48:10.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL.

Association Connecting Electronics Industries (IPC)

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Ohio Valley Expo & Tech Forum

Industry News | 2010-06-30 12:09:49.0

MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Industry News | 2012-09-26 07:31:28.0

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,

Finetech

Finetech to Highlight Precision Rework and BGA Reball systems at SMTAI 2010

Industry News | 2010-10-01 01:05:06.0

Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Finetech

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

Industry News | 2011-05-10 19:11:40.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.

MARTIN (a Finetech company)

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Upper Midwest

Industry News | 2010-05-29 18:57:32.0

MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-17 14:59:07.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Finetech

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Industry News | 2010-09-15 21:55:19.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

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