Industry News | 2018-02-12 10:15:49.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-06-03 19:35:57.0
Nordson ASYMTEK will showcase a powerful array of dispensing and conformal coating systems and valves at SMT Nuremberg 2018, Nuremberg Germany, from June 5-7, in the SMARTec stand 4-401. In addition, the Spectrum™ II S2-900 precision fluid dispensing system and the Thermal Cure TC-2400 for curing underfill will be demonstrated in the Future Packaging line at Stand 5-434.
Industry News | 2018-08-06 20:44:43.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.
Industry News | 2024-02-26 09:12:50.0
Explore the technical prowess of I.C.T's Selective Wave Soldering Machines, boasting advanced features like precise flux application and innovative preheating systems. Discover how these machines redefine efficiency and reliability in electronic assembly.
Industry News | 2024-05-17 19:04:32.0
The SL-1040 takes coating performance to the next level through improved yield and uptime with enhanced selectivity and flexibility for high-volume electronics manufacturing
Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
Industry News | 2013-04-03 18:46:12.0
IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.
Industry News | 2016-04-29 11:38:38.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.
Industry News | 2016-07-02 06:45:13.0
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.
