Industry News | 2010-11-06 17:29:32.0
Industry estimates project that by the end of 2010, printed electronics will be 35 percent of a $1.92 billion printed, thin film and organic electronics market.
Industry News | 2015-12-01 11:28:48.0
Today, Congressman Chris Van Hollen (D-MD-8) met with executives and employees of IPC-member company Zentech Manufacturing, Inc. at the company's manufacturing facility in Baltimore, Maryland. Coordinated by IPC, the world’s leading association for electronics manufacturing companies, this visit is part of a nationwide effort to educate policymakers about legislative and regulatory issues that affect the electronics manufacturing industry.
Industry News | 2021-02-03 13:41:02.0
Changing technologies, advanced materials and new processes that are driving the electronics manufacturing industry will take center stage throughout the IPC APEX EXPO 2021 technical conference and professional development sessions, which will take place virtually March 8-12. Registration is now open at www.IPCAPEXEXPO.org.
Industry News | 2021-06-15 04:59:31.0
New awards include NexGen and Student Research contributions, increased honoraria
Industry News | 2020-12-01 17:14:52.0
Heralds Design-through-Manufacturing 4.0
Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
Industry News | 2024-10-13 18:41:25.0
New white paper serves as a blueprint for strengthening PCB assembly capabilities in the United States
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2023-02-13 15:24:20.0
From the show floor – where 375 exhibitors displayed a multitude of high-tech machinery and in some cases artificial intelligence – including cutting-edge assembly, testing and inspection equipment, software automation, laser systems, additive manufacturing and factory of the future technologies, to dozens of technical conference sessions and PD courses covering such hot-topic tracks as smart factories, PCB fabrication and materials and high-density interconnects, IPC APEX EXPO 2023 was fueled by the possibilities of new advances in electronics manufacturing.
