Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
Industry News | 2001-08-24 10:09:50.0
Austin American Technology has successfully qualified and is now introducing an automated cleaning and drying system based on its highly successful Mach I and Mach III Series HydroJet Inline Cleaner. Advances and improvements in the configuration of the system have given it the ability to efficiently clean and thoroughly dry delicate Flip Chip assemblies at in-line speeds.
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
Industry News | 2001-06-26 09:50:17.0
The Mega™ II's revolutionary closed-loop, solvent (or water), electronic assembly and parts cleaning system with quantitative ION detection and statistical process control capability is ideal for Flip Chip, Optoelectronics, and advanced or high reliability technology packages and assemblies.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2010-05-21 13:26:39.0
Televés invested once again in a new SMT production line consisting of the latest SIPLACE SX2 and SIPLACE CA machines
Industry News | 2007-11-01 01:27:50.0
Compared to standard halogen lighting, LED technology provides several benefits, including high-energy efficiency results in significantly reduced heat dissipation. Furthermore, they provide remarkably better luminance values (up to 400 Lumen) and a ten times longer lifespan than with standard halogen, making LED lighting the best choice to meet your rework and micro assembly challenges.
Industry News | 2007-11-27 12:28:45.0
FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.
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