Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2021-02-08 15:16:46.0
BTU International, Inc. will participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company will highlight the PYRAMAX™ Vacuum reflow oven during the virtual event.
Industry News | 2019-03-05 17:38:07.0
PDR announces the release of the latest software features to complement its award-winning ThermoActive Suite Software. The new Events Module offers enhanced audio, visual, and machine function activation tools that allow the operator to set up audio tones, visual operator messaging, and machine function activities such as forced air cooling and vacuum pump activation all in an easy-to-use operator interface.
Industry News | 2020-04-02 17:12:17.0
SEHO's GoReflow-plus convection reflow soldering system represents the ideal solution for SMT productions with medium-sized volumes that attach great priority to high solder joint quality, cost-efficiency and high flexibility. The system convinces with its well-engineered concept, excellent soldering results and unbeatable price-performance-ratio.
Industry News | 2011-09-28 19:37:44.0
Nihon Superior introduces the new Selector Guide for SN100C solder pastes.
Industry News | 2021-02-23 15:00:48.0
BTU International, Inc. today announced plans to exhibit at SEMICON China, scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre. The PYRAMAX™ Vacuum Reflow Oven will be displayed in the CohPros booth, Hall E7 #7343.
Industry News | 2021-11-17 15:16:38.0
BTU International, Inc. is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Reflow Ovens for its PYRAMAX™ Vacuum Reflow Oven. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany. This is the fifth industry award that BTU has received for the PYRAMAX Vacuum.
Industry News | 2019-11-13 11:33:38.0
SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.
Industry News | 2020-05-30 12:34:54.0
SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.
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