Industry News | 2008-05-18 01:34:26.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it can perform material dispensing and consecutive placement of LEDs on film substrates.
Industry News | 2022-03-30 14:59:52.0
YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.
Industry News | 2009-12-07 18:52:26.0
With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family. The modular thinking behind the FINEPLACER ®s has been further perfected. Depending on the customer's requirements, the platform can be configured either as a high-end rework system or as a high-precision assembly and bonding system. In each case there are two accuracy options available, of 10 µm and 3 µm.
Industry News | 2016-03-03 08:45:28.0
Henkel Adhesive Technologies today announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. A one-part, thermally conductive, liquid formable gel, Liqui-Form 3500 combines high thermal conductivity with process flexibility and excellent reliability.
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
Industry News | 2014-03-20 14:21:26.0
COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.
Industry News | 2020-01-17 09:37:21.0
Scheugenpflug AG is now part of the Swedish industrial group Atlas Copco. The closing of the purchase agreement took place on January 2, 2020, after the competition authorities had also approved the planned acquisition. The existing Managing Board of the dispensing technology specialist is strengthened by Olaf Leonhardt as new Chairman of the Managing Board.
Industry News | 2021-12-21 14:50:03.0
Anda Technologies today announced plans to exhibit at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The team will showcase the Anda AP-3P for the first time in the US in Booth #1307.
Industry News | 2022-01-14 17:09:10.0
The Murray Percival Company is pleased to announce that it now represents Anda Technologies' conformal coating, plasma treatment, curing ovens, and full line solutions.
Industry News | 2019-04-10 10:19:18.0
(Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.
