Industry News | 2008-04-07 22:15:22.0
OXFORD, CT � March 31, 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it has been awarded a 2008 NPI Award in the category of Test & Inspection, AOI for its MV-7L In-Line AOI System. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
Industry News | 2020-04-11 14:25:00.0
Increased capabilities in lab will support increased research and training opportunities in photonic
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2017-09-18 14:36:13.0
CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium held at the Archie K. Davis Conference Center in Research Triangle Park, NC from November 28 - November 30, 2017.
Industry News | 2016-10-20 19:12:21.0
CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium at the Crowne Plaza Midtown in Atlanta, GA from November 29 to December 1, 2016.
Industry News | 2017-05-30 19:40:07.0
The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.
Industry News | 2008-05-18 00:07:34.0
MINNEAPOLIS, MN � The SMTA is pleased to announce Edward Zoiss as the keynote speaker for the AIMS Harsh Environment Electronics Workshop. The workshop will be co-located with SMTA International at Disney's Coronado Springs Resort and Convention Center in Orlando, Florida on August 18-19, 2008.
Industry News | 2008-09-02 15:34:36.0
Minneapolis, MN � The 2008 Charles Hutchins Educational Grant recipient, Lei Nie, a graduate student in the field of Mechanical Engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process".
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2017-08-16 17:35:27.0
Count On Tools is pleased to announce that with the recent expansion of its manufacturing facility, the company has purchased and installed two DMG NHX-4000 horizontal milling centers to further increase production capabilities and lower product lead times. The new equipment expands COT’s current capabilities into more complex parts that can be manufactured with significant costs savings to the end-user.
