Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2018-08-29 19:35:22.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.
Industry News | 2010-05-11 11:59:56.0
GAINESVILLE, GA - Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its new series of custom SMT pick-and-place nozzles for CREE® LED components. This new series is manufacturer-approved, based on CREE Inc.'s strict requirements and specifications.
Industry News | 2011-01-31 22:13:54.0
Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for CREE® XLamp® XM-L LED components. The new series is manufacturer-approved, based on CREE Inc.’s strict requirements and specifications.
Industry News | 2013-10-11 08:17:05.0
Count On Tools Inc. (COT), is pleased to announce that it has been invited to take part in the Cree Solution Provider Program (CSP).
Industry News | 2020-03-05 17:49:27.0
-14 colors comply with automotive industry requirements and UL standards -Globally available in small quantities as production ramps up -Connectors needed in next-generation automobiles
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2017-02-07 15:46:59.0
The best technical conference paper of IPC APEX EXPO® 2017 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 14.
Industry News | 2014-11-25 17:04:36.0
During the 2014 Annual Meeting at SMTA International, the SMTA announced that Christine Taylor, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2014 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages."
Industry News | 2011-10-08 18:45:48.0
Flexible printed circuits are electro – mechanical devices. They require sound design practices to be successful. This presentation will cover these design techniques which focus on stress management and the flex material properties which drives these design techniques resulting in robust flex circuit designs.
