Industry News: medium manual printer[0] (Page 10 of 12)

Flying Probe Test - The Rules Have Changed

Industry News | 2013-03-20 23:21:03.0

On November 22, 2012, SEICA Italy held a technical seminar dedicated to the electronic testing of PCBs. This meeting was the official opportunity to present to the attending companies the new product line called RAPID; flying probers targeted to PCB testing. The product represents the combined knowledge and expertise of the SEICA BBT line, and is based on the "Ultra Fast” technology. In addition to speed, attention to aesthetics and improved ergonomics were also very important. Compactness and rationality, combined with the software ease of use, are the result of Seica’s research to develop a system that is simple to use and maintain.

SEICA SpA

Desktop system for finding faulty PCB components

Industry News | 2020-10-26 10:54:29.0

Does it sound familiar? Does your company operate expensive and sophisticated electronic equipment, such as an electron microscope, a CNC machine, an industrial PLC, etc.? The failure of any printed circuit board (PCB) leads to a long downtime of both equipment and personnel, while the manufacturer's specialists carry out diagnostics and repairs. That's all about time and money. It seems unlikely that the manufacturer has a spare parts warehouse (SPTA) in every city. Storing the spare parts for all the boards yourself is very expensive and usually impractical. In case the device is under warranty repair costs will be paid by the manufacturer. But what if warranty has expired long ago? Complex expensive equipment can be used for 3, 5 or 10 years, and that is not the limit.

Engineering Physics Center of MSU

ESSEMTEC exhibits precise semi-automatic printer SP150, Pantera XV and RO300FC-C at COMPONEX NEPCON 2009 in Delhi

Industry News | 2009-01-19 20:34:37.0

Essemtec, the leading manufacturer of surface mount technology production equipment, announces that it will highlight the printer SP150, the pick & place machine Pantera XV and the full convection oven RO300FC-C with RO-CONTROL software in hall no. 18, stand no. 338 at the upcoming COMPONEX NEPCON 2009 exhibition, scheduled to take place February 24-26, 2009, in Delhi, India.

ESSEMTEC AG

Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at SMTA Southeast Asia Technical Conference 2009

Industry News | 2009-11-02 21:58:24.0

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.

Nihon Superior Co., Ltd.

Highly Flexible and Fast SMD Assembly Machine - Essemtec Introduces New Cobra Pick-and-Place System at SMTA International

Industry News | 2010-09-29 23:17:20.0

Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.

ESSEMTEC AG

Essemtec’s Technology Day to Highlight Future Dispensing and MID Technologies

Industry News | 2012-11-06 11:22:15.0

Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.

ESSEMTEC AG

ESSEMTEC to Exhibit Its Scorpion in America for the First Time at the IPC APEX EXPO

Industry News | 2013-01-14 14:43:06.0

Essemtec, announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX EXPO

ESSEMTEC AG

ESSEMTEC to Highlight a Range of Leading-Edge Technologies at SMT Hybrid Packaging 2013

Industry News | 2013-04-10 11:48:47.0

Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

ESSEMTEC AG

Precision Versatile Dispensing Solutions from Techcon at Productronica

Industry News | 2013-10-10 11:11:32.0

Techcon Systems will showcase the newly released TS9000 Series Jet Tech valve in Hall A4, Stand 221 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Techcon Systems

Press preview for Seica Inc. participation at Apex, San Diego, California, February 27, 28 – March 1, 2018, Booth 2323, San Diego Convention Center.

Industry News | 2018-01-09 19:04:20.0

Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.

SEICA SpA


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