Industry News | 2008-07-24 17:38:17.0
Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.
Industry News | 2018-09-04 05:34:10.0
The AMD Radeon™ Pro V340 graphics card is a dual-GPU solution based on the advanced AMD “Vega” architecture1, optimized to deliver extreme performance and high user density for virtualized environments. It is the first VDI hardware solution equipped with 32GB of ultra-fast, second-generation high-bandwidth memory, providing massive amounts of memory and bandwidth for today’s most complex design and media workloads.
Industry News | 2016-04-29 11:57:30.0
ADLINK Technology introduces the cPCI-A3515, the company's first product in a new series of CompactPCI® Serial processor blades. This new 3U module features an Intel® Core™ processor and supports the CompactPCI Serial industry standard for applications requiring reliable high-speed, high-bandwidth data communications, such as railways, factory automation, and defense.
Industry News | 2014-01-24 15:31:06.0
Since the Compact Flash Association released the specification of CFast 2.0, Apacer has invested actively in R&D and taken the lead to roll out the first CFast 2.0 memory card - CFast 2, around the globe with SATA 3.0 (6Gb/s) high-speed transmission interface.
Industry News | 2004-05-19 11:29:35.0
PC/104 Form Factor PCMCIA (PC Card) Adapter Optimized for Embedded Applications Requiring Reduced Size, Modularity, Field Upgradeability, and Low-Power Consumption
Industry News | 2021-01-06 09:50:55.0
Agreement Establishes Highly Certified Distributor New Yorker Electronics as Preferred Supplier of Advanced Solid State Memory Systems
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2014-06-30 14:25:43.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
Industry News | 2014-07-08 11:04:03.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.
Industry News | 2014-08-12 16:03:12.0
(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.
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