Industry News: memory module tester (Page 1 of 40)

GPD Global Signs Distribution Agreement with Aegis for CircuitCAM Express

Industry News | 2013-06-07 15:36:04.0

GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.

GPD Global

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

OneChip Photonics Facility In Canada Closing – All Assets Being Sold

Industry News | 2014-06-03 13:04:15.0

The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.

Baja Bid

Two Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

Industry News | 2024-04-22 10:41:54.0

The Dieter Bergman IPC Fellowship award was presented to two IPC volunteers at IPC APEX EXPO 2024. The award recipients have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts. Tiberiu Baranyi and Zhiman Chen were chosen as award recipients as they embody the work ethic and spirit of the late Dieter Bergman, an industry pioneer and icon. As part of the award, they bestowed Dieter Bergman Memorial Scholarships to the university or college of their choice.

Association Connecting Electronics Industries (IPC)

Electrochemical Reliability Is the Focus of Session 4 at SMTA Europe's Harsh Environments

Industry News | 2018-04-15 20:01:15.0

SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)

Technology, Economics and Electronics to Converge at IPC Technology Market Research Conference (TMRC)

Industry News | 2013-09-17 17:28:51.0

Industry thought leaders will present a high-level look at new technologies against a backdrop of domestic and global economics during the IPC Technology Market Research Conference (TMRC), September 25–26 in Chicago.

Association Connecting Electronics Industries (IPC)

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology

Industry News | 2008-07-24 17:38:17.0

Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.

ASYMTEK Products | Nordson Electronics Solutions

Cisco Executive to Keynote 15th Annual Atlanta SMTA Expo

Industry News | 2011-04-01 13:14:24.0

The Surface Mount Technology Association (SMTA) announced today that Mark Brillhart, Vice President, Technology and Quality, Cisco, would keynote on the state of the electronics industry at its 15th annual Atlanta SMTA Expo Thursday, April 21, 2011 at 9:30 am at the Gwinnett Civic Center.

Surface Mount Technology Association (SMTA)

‘Origins of Silicon Valley’ Is Keynote Topic of International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2013-06-20 19:16:54.0

SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for the 10th Anniversary of the International Wafer-Level Packaging Conference, November 5-7, 2013 in San Jose, CA.

Surface Mount Technology Association (SMTA)

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