Industry News | 2012-04-10 16:15:40.0
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that the InStrip® provides a high parallel test handling solution not only for ASICS and sensors in strips
Industry News | 2018-03-13 16:40:22.0
Multitest has been the market leader for MEMS/sensor test and calibration equipment for more than 15 years. Multitest has now launched the next generation of its 6DOF gyro test module for singulated packages, which provides significant production benefits resulting in even lower cost of test, enhanced test accuracy and higher daily output.
Industry News | 2010-02-08 12:06:53.0
Rosenheim, February 2010: Multitest received the first multi-system order for the new InCarrier™ handler by a European IDM. The systems will be used for high-parallel test of small MEMS sensors.
Industry News | 2021-12-07 14:53:11.0
SEMICON West 2021 - 7 - 9 December
Industry News | 2011-06-07 15:02:59.0
Multitest has received another order for its unique InCarrier® test equipment from a major test house in Asia. The InCarrier® was preferred against standard singulated package test as well as other methods of high parallel test.
Industry News | 2013-03-28 11:03:15.0
Multitest, will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2013-06-25 11:29:47.0
Multitest, announces that Klaus Ruhmer will present at Test Vision 2020, in conjunction with SEMICON West, scheduled to take place July 10-11, 2013 at the San Francisco Marriott Marquis.
Industry News | 2012-12-12 12:36:52.0
InvenSense today announced that its 3rd NF-Shuttle, that allows 3rd-party developers to build MEMS prototypes on the company’s proprietary MEMS fabrication process, is scheduled to launch on January 7. The company also announced it is now taking orders for its 4th NF-Shuttle, which is slated to launch in May 2013. NF-Shuttle designs are fabricated on the same NF Platform that produced several hundred million inertial MEMS units for InvenSense.
Industry News | 2012-12-04 13:42:40.0
Multitestannounces that its equipment fully supports the advantages of MEMS Oscillators.
