Industry News: metall (Page 4 of 217)

SMTA China Presents Seven Best-Paper/Presentation Awards and Two Best Exhibit Awards at SMTA China South 2015 Conference/NEPCON South China 2015

Industry News | 2015-09-03 16:37:18.0

SMTA China announces that it presented awards for seven papers at the SMTA China South 2015 Conference Award Presentation Ceremony, held on Tuesday, August 25, 2015 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Vitronics Soltec Introduces 3D-Printed Twin-Nozzle for ZEVA Point-to-Point Selective Soldering

Industry News | 2020-04-14 22:14:18.0

ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.

ITW EAE

SMTA Announces �Best of Conference� Award for Pan Pacific 2008 Symposium

Industry News | 2008-03-07 11:47:13.0

Minneapolis**, MN*� The Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that took place January 22-24, 2008 in Kauai, Hawaii was a great success. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

Surface Mount Technology Association (SMTA)

SMTA Europe Announces 1st Session of Technical Program for Harsh Environments Conference

Industry News | 2018-04-09 19:48:04.0

SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Industry News | 2018-04-22 19:12:45.0

SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead-Free Solder

Industry News | 2003-06-11 08:00:48.0

IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.

Association Connecting Electronics Industries (IPC)

IPC Criticizes Bad Science, Methodology In Greenpeace Electronics Guide

Industry News | 2010-11-15 22:52:31.0

IPC — Association Connecting Electronics Industries® is criticizing the "bad science" in the latest revision to Greenpeace’s electronics scorecard, "Guide to Greener Electronics." The guide rates consumer electronics companies against Greenpeace criteria on hazardous substances, take back and recycling, and energy use and climate change.

Association Connecting Electronics Industries (IPC)

Environmental Programs at IPC APEX EXPO Strive to Put Green Initiatives’ Destiny Back In the Hands of the Electronics Industry

Industry News | 2011-03-01 15:16:01.0

It's not difficult today to find articles and blogs written about green initiatives around the world, and more so about some non-governmental organizations (NGOs), that elicit strong opinions from electronics manufacturers. According to IPC’s Director of Environmental Policy Fern Abrams, the issue isn't that the industry does not support green initiatives, but rather that some of these initiatives give the appearance of helping the environment when they ultimately do not. To help quench electronics manufacturers’ needs for fact-based support, IPC will host a number of programs at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas.

Association Connecting Electronics Industries (IPC)

Industry Buzzing Over New Free Sessions at IPC APEX EXPO™

Industry News | 2011-03-11 17:28:15.0

Very few attendees can — or even try — to take advantage of all of the resources on-site at IPC APEX EXPO, taking place April 12–14, 2011 in Las Vegas. To optimize their time at the event, visitors can get even more questions answered at free educational "BUZZ Sessions" taking place on the show floor. Panelists at these interactive discussion forums will discuss many of the topics keeping the electronics manufacturing industry buzzing.

Association Connecting Electronics Industries (IPC)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)


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