Industry News | 2022-03-03 16:21:56.0
During his State of the Union address tonight, U.S. President Joe Biden is expected to urge Congress to pass much-needed funding for semiconductor manufacturing and other advanced technologies as part of a new competitiveness measure. Both the House- and Senate-passed bills include $52 billion in funding as well as additional measures to boost American R&D, which will help reestablish the United States as a global leader in building the technologies of the future. IPC applauds President Biden's continued focus on the semiconductor shortage and his ongoing efforts with Congress to finalize the "USICA/America COMPETES" legislation.
Industry News | 2018-10-18 11:18:14.0
Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design
Industry News | 2018-12-08 03:35:10.0
Top 10 Consumer Electronics Companies in the World
Industry News | 2019-06-09 20:06:49.0
CheckSum wants the world to know that their Parallel Technology offers many advantages by testing in line as opposed to in a test cell, avoiding costly potential issues down the line.
Industry News | 2022-02-16 02:55:47.0
"Mahogany" EVK Targets Low-Lane Count Applications Using SwitchtecTM PFX PM40052
Industry News | 2009-06-20 17:49:03.0
Agilent Technologies Inc. (NYSE: A) today kicked off its Agilent Digital Measurement Forum (ADMF) in Seoul, Korea. The annual forum, which brings together local and global industry leaders to address all digital-related measurement solutions from consumer electronics to high-speed digital design, will be held in six countries in the Asia-Pacific region from June 18 to July 16. Partners and collaborators such as Xilinx, The MathWorks and Microchip Technology are participating in the forum.
Industry News | 2011-07-26 21:03:11.0
BPM Microsystems will highlight its model 2800, the newest addition to its manual universal device programmer family at the upcoming Microchip MASTERs Conference. The 2800 combines the unrivaled speed of Vector Engine Co-Processor® technology plus true universal device support, resulting in the fastest universal programmer in the industry.
Industry News | 2017-01-24 10:55:12.0
BP 256 is YINCAE’s new ball attach adhesive product
Industry News | 2017-06-06 10:38:43.0
YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
Industry News | 2017-06-13 09:00:37.0
YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
