Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2019-03-25 19:02:23.0
IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Industry News | 2020-02-18 14:26:44.0
Deadline extended to February 21, 2020
Industry News | 2018-08-29 19:35:22.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.
Industry News | 2018-05-01 19:25:27.0
Mil-aero and automotive engineers who want to increase their knowledge of electronics subjected to harsh use environments should attend IPC’s High Reliability Forum in Linthicum (Baltimore), Md., May 15-17, 2018.
Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
