Industry News: miniature stencil (Page 7 of 9)

Heraeus Electronics showcases new portfolio for next-generation power electronics and semiconductor advanced packaging at SEMICON Korea 2023

Industry News | 2023-01-30 16:56:37.0

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Heraeus

Indium Corporation Expert to Present at SiP Conference China

Industry News | 2021-08-28 04:15:29.0

Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.

Indium Corporation

Kyzen's Dr. Mike Bixenman to Present at the Cleaning Electronic Assemblies Workshops in Texas

Industry News | 2011-07-22 23:23:08.0

Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present at the upcoming technical workshops titled “Cleaning Electronic Assemblies”, that will be held at two separate locations in Texas.

KYZEN Corporation

PACE & Cumberland Electronics to Present BGA/Area Array Component Rework Workshops in Philadelphia & Baltimore in September

Industry News | 2019-08-29 21:58:20.0

PACE Worldwide and Cumberland Electronics have teamed up to host two separate Technical Workshops on "Non-Destructive BGA/Area Array Component Rework" on September 10th at ACI Technologies in Philadelphia PA, and on September 12th at the PACENTER Training Center in Elkridge MD.

PACE Worldwide

Indium Corporation¬ Receives EM World's Innovation Award for Jetting, Microdispensing Paste

Industry News | 2022-07-31 19:44:07.0

Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.

Indium Corporation

Expect More from DEK at NEPCON Shanghai 2008 - Hall W1, Booth 1B30

Industry News | 2008-03-24 22:29:31.0

The DEK team is planning to celebrate the mass imaging leader�s 40th anniversary in style at this year�s Nepcon China, bringing a wide variety of pioneering print platforms and Productivity Tools to the Shanghai Everbright Convention & Exhibition Centre over April 8-11. Visitors can meet the DEK team on booth 1B30 where the company will be demonstrating its expert knowhow in action.

ASM Assembly Systems (DEK)

Aqueous Technologies and Kyzen to Present Free Technical Workshops in Texas

Industry News | 2011-07-20 14:21:19.0

Aqueous Technologies and Kyzen will hold a free technical workshop titled “Cleaning Electronic Assemblies” at two separate locations in Texas. The first workshop is scheduled to take place Tuesday, August 2, 2011 from 9 a.m.-4 p.m. at the Doubletree Hotel in Richardson, TX and the second will be held on Thursday, August 4, 2011 from 9 a.m.-4 p.m. at the Hilton Hotel in Houston, TX.

Aqueous Technologies Corporation

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

Indium Corporation's Proven Jetting Paste Recommended by NSWAutomation

Industry News | 2020-12-03 13:07:26.0

Indium Corporation's newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSWAutomation for use with their newest microfluid dispenser, SD1.

Indium Corporation

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited


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