Industry News | 2003-04-08 14:01:01.0
Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2011-10-21 13:57:49.0
The Board of Directors for IPC endorsed the association’s long-term strategy at its final meeting in 2011.
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Industry News | 2012-10-31 15:53:31.0
B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2003-02-07 08:40:55.0
The Industry's Most Invaluable Tool for Quality Assurance and Assembly Departments is Now Available in Japanese, German, Czech and Danish
Industry News | 2009-04-15 23:14:33.0
BANNOCKBURN, Ill., USA, March 31, 2009 � IPC � In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees, and exceptional lifetime achievement, IPC � Association Connecting Electronics Industries� bestowed the 2009 Raymond E. Pritchard IPC Hall of Fame Award to Bill Jacobi, former president and CEO, William Jacobi and Associates, and Dan Feinberg, owner, Fein-Line Associates. Presented at IPC APEX EXPO� in Las Vegas, the Hall of Fame Award represents IPC's highest level of member recognition.
Industry News | 2010-08-25 14:54:48.0
Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC’s professional development program at Electronics Midwest. On September 27 and September 29–30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.
