Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2012-04-27 19:20:10.0
PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2008-09-10 09:31:07.0
Saturn Electronics Corp. Providing Criteria for the Industry
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Industry News | 2012-11-26 14:04:53.0
The IDTechEx report The Market for Gold Inks 2013-2019 is looking to identify and assess the opportunities for a printable nano-gold ink, excluding its use in graphic arts applications (where it could be used for both its graphic arts benefits in addition to being used as a functional component in a circuit, such as printed touch switches, are taken into account). Save 25% online by quoting REP2012.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2014-02-18 17:14:55.0
FCT Assembly will debut the new NanoSlic® Gold stencil in Booth #2175 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
