Industry News: minimum intermetallic thickness ipc (Page 1 of 2)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Cobar Expert Gerjan Diepstraten to Discuss Reflow Soldering during IPC Midwest 2012 Conference

Industry News | 2012-07-25 15:16:14.0

The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference

Balver Zinn

Nihon Superior to Showcase Newly Expanded Range of SN100C Soldering Materials at Mexitr�nica 2008

Industry News | 2008-10-07 20:52:28.0

OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at SMTA Southeast Asia Technical Conference 2009

Industry News | 2009-11-02 21:58:24.0

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO

Industry News | 2013-01-16 08:45:06.0

Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.

Nihon Superior Co., Ltd.

Ersa Announces Successful IPC APEX EXPO

Industry News | 2019-02-19 20:04:05.0

Kurtz Ersa is pleased to announce that it had a successful IPC APEX EXPO, and even picked up two 2019 NPI Awards from CIRCUITS ASSEMBLY magazine. Vice President of Sales – North America, Ernie Grice stated: "This year’s show produced a record number of booth visitors and interest. We remain optimistic of the business year ahead, certainly with these two NPI Awards we feel we have the right products for the changing markets we serve.”

kurtz ersa Corporation

Ersa Awarded for New XL Rework and Selective Solder Systems at APEX

Industry News | 2019-01-30 20:56:59.0

Kurtz Ersa today announced that it received two 2019 NPI Awards in the categories of Repair / Rework for the HR 600 XL, and Soldering – Selective for the VERSAFLOW 4XL. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

kurtz ersa Corporation

MPI Realizes Outstanding Benefits from ViTrox’s V810 Standard AXI System

Industry News | 2015-08-11 13:31:16.0

“The ViTrox V810 system has proven to be quite capable in its intended mission, helping us produce defect-free product for IPC610, Class III customers in the Defense, Aerospace, Industrial Computing and Medical market sectors. The machine is very reliable and we really appreciate the outstanding support from the ViTrox team for training, upgrades and technical information.” Dane Wentworth, Senior Vice President, MPI

ViTrox Technologies

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

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minimum intermetallic thickness ipc searches for Companies, Equipment, Machines, Suppliers & Information

Association Connecting Electronics Industries (IPC)
Association Connecting Electronics Industries (IPC)

IPC is the trade association for the printed wiring board and electronics assembly industries.

Training Provider / Events Organizer / Association / Non-Profit

3000 Lakeside Drive, 309 S
Bannockburn, IL USA

Phone: 847-615-7100

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