Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2018-10-18 11:07:09.0
What is the Maximum Panel Size for PCB Printing?
Industry News | 2010-06-11 14:35:28.0
GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, has released a full line of standard 300-series nozzles for the Assembléon MC-24 and MC-24X as well as the Yamaha YG300. The new line is capable of handling components sizes from 01005 to larger BGAs and QFPs for large mix and minimum changeover to optimize production lines.
Industry News | 2018-10-18 11:23:54.0
6 Things to Check Before Submitting Your PCB Design for Manufacturing
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2019-01-05 08:22:29.0
Count On Tools will exhibit in Booth #1637 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29 - 31, 2018 at the San Diego Convention Center in Calif. The COT team will continue its focus on its core product lines at the show:
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2014-05-01 07:47:51.0
Not only the placement speed, but the flexibility of component parts and PCB formats, as well as the ease of programming and the reliability of the assembly from lot size 1 are the decisive criteria for small batch/ prototype production.
Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
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