Industry News: missing components root cause (Page 1 of 11)

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

SMTA Announces Upcoming Webinars

Industry News | 2010-02-18 21:26:02.0

Minneapolis, MN - The SMTA is pleased to announce several new webinars coming up in March. Webinars are 60 to 90 minute online presentations comparable to a conference session. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.

Surface Mount Technology Association (SMTA)

SMTA International Tackles Head-in-Pillow Defects

Industry News | 2011-08-17 12:59:10.0

The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.

Surface Mount Technology Association (SMTA)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

Count On Tools Offers Urethane Nozzle Series for Ultra-Smooth Components

Industry News | 2012-08-28 09:54:11.0

Count On Tools Inc., announces a breakthrough in custom nozzle engineering for ultra-smooth components from the semiconductor market.

Count On Tools, Inc.

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Two Speakers

Industry News | 2008-09-12 03:52:21.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Laura Turbini (Session Chair) of Research in Motion, Doug Pauls of Rockwell Collins, Joe Russeau of Precision Analytical Laboratory, Steven Perng of Cisco Systems, and Jack Fischer of Interconnect Technology Analysis will present in Session 2 on Cleanliness Assessment. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman

Industry News | 2015-05-18 21:29:50.0

The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.

Surface Mount Technology Association (SMTA)

Industry's Most Baffling Defects No Match For Free Process Defect Clinic At IPC Apex Expo 2012

Industry News | 2011-12-02 18:36:19.0

Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.

Association Connecting Electronics Industries (IPC)

IPC to Host High Reliability Forum in Baltimore Technical conference to focus on electronics subjected to harsh use environments

Industry News | 2018-05-01 19:25:27.0

Mil-aero and automotive engineers who want to increase their knowledge of electronics subjected to harsh use environments should attend IPC’s High Reliability Forum in Linthicum (Baltimore), Md., May 15-17, 2018.

Association Connecting Electronics Industries (IPC)

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