Industry News: mixed (Page 13 of 195)

Selective Wave Soldering Machine: A Guide to Superior Soldering

Industry News | 2024-05-30 06:17:17.0

In electronics manufacturing, choosing between conventional wave soldering machine and selective wave soldering machine is crucial. This decision impacts the quality and efficiency of the assembly process. For those looking to enhance their soldering operations, exploring the benefits of a selective wave soldering machine is essential. Contact us to learn more about our selective wave soldering machines today!

I.C.T ( Dongguan ICT Technology Co., Ltd. )

IPC Releases APEX 2003 Professional Development Schedule

Industry News | 2002-11-20 11:33:36.0

IPC Releases APEX 2003 Professional Development Schedule, Creates 19 Unprecedented Courses

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and On-line Registration Now Open

Industry News | 2009-07-24 14:12:49.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

Three Important Symposia Featured at SMTA International

Industry News | 2009-07-30 21:44:14.0

Minneapolis, MN - The SMTA is pleased to announce three symposia to be featured at SMTA International: the Evolving Technologies Summit, Contract Manufacturing Symposium, and Lead-Free Soldering Technology Symposium.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA Announces International Wafer-Level Packaging Conference (IWLPC) Call for Papers

Industry News | 2010-02-01 13:36:36.0

Minneapolis, MN - The SMTA, in conjunction with Chip Scale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the Marriott Santa Clara Hotel in Santa Clara, CA. The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program on or before April 23, 2010.

Surface Mount Technology Association (SMTA)

Dr. Bradley McCredie to Present Keynote at 2010 International Wafer-Level Packaging Conference

Industry News | 2010-06-21 14:15:46.0

Minneapolis, MN - The SMTA and Chip Scale Review magazine proudly announce that Bradley McCredie, Ph.D., IBM Fellow and Vice President of IBM Systems and Technology Group, will be the keynote speaker at the 7th Annual International Wafer-Level Packaging Conference being held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Dr. McCredie will present "Technology Scaling, Packaging, and Other Things That Might Put Our Kids Through College".

Surface Mount Technology Association (SMTA)

SMTA Announces 7th International Wafer-Level Packaging Conference (IWLPC) Program

Industry News | 2010-06-28 16:44:36.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Registration is now available on-line. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2010-09-02 11:07:09.0

The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)


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