Industry News: mm any considered 200 or laser (Page 1 of 3)

Virtual Industries Introduces New Extended Reach Tips for Handling Solar Cells, Wafers or Other Substrates

Industry News | 2009-10-31 01:46:24.0

COLORADO SPRINGS, CO — October 29, 2009 — Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, introduces the Extended Reach series of substrate handling tips for solar cells, wafers or flat panels.

Virtual Industries, Inc.

Optimize Laser Soldering with Japan Unix’s New Multi-Phi Technology

Industry News | 2015-05-19 20:13:03.0

Japan Unix announces that Multi-ɸ (Phi) Laser Soldering now is available. The variable laser spot diameter system optimizes soldering conditions for each component.

Japan Unix Co., Ltd.

New Laser Compression Bonder Provides Warpage-free Package Bonding

Industry News | 2021-07-08 05:33:04.0

Laserssel Co., LTD is pleased to introduce its CLSR 6000 high-end Laser Compression Bonder for semiconductor packages. This soldering technique uses high accuracy compression tools and Area Laser bonding introduced with LSRTM(Laser Selective Reflow) in order to minimize warpage on extremely thin packages and substrates. This technology has been adopted for high-end 2.5D packaging with dimensions larger than 60x60mm and NAND modules thinner than 50 µm.

Laserssel Corporation

New Photonic Soldering System For Selective Assembly.

Industry News | 2001-01-25 17:34:02.0

ViTechnology introduces the LS-200 for selective soldering and rework of all types of components, from BGAs to large QFPs and even odd-shaped and hybrid devices. This new system is ideal for soldering and desoldering RF shielding and various paste in hole and solder-paste-on-through-hole applications. The LS-200 offers high quality rework with fewer rejects, and a 30% shorter repair time when compared to hot air systems.

Vi TECHNOLOGY

Laserssel Wins TWO 2021 Mexico Technology Awards

Industry News | 2021-11-03 13:33:10.0

Laserssel Co., LTD is pleased to announce that it received two 2021 Mexico Technology Awards in the categories of Bonding Equipment for its LCB 3000 Laser Compression Bonder and Rework & Repair for its Laserssel rLSR Mini LED Rework System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

Laserssel Corporation

Juki Debuts JX-200LED High Speed Placement System for LED Applications

Industry News | 2011-02-23 20:06:19.0

Juki Corporation introduces the JX-200LED for the LED assembly market. Targeted specifically for LED manufacturing, the JX-200LED features new algorithms created for the placement of side- and top-view LEDs.

Juki Automation Systems

Juki's JX-100 Wins a 2009 Innovation Award

Industry News | 2009-04-23 20:27:32.0

MORRISVILLE, NC - April 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it has been awarded a 2009 EMAsia Innovation Award in the category of Pick and Place Systems/Equipment (Low/Medium Volume) for its JX-100. The award was presented to the company during an April 22, 2009 ceremony that took place at The Foyer outside the Grand Ballroom of the Shanghai Everbright International Hotel during Nepcon China 2009.

Juki Automation Systems

Juki to Introduce JX-100 Flexible Compact Mounter at APEX 2009

Industry News | 2009-03-18 15:54:18.0

MORRISVILLE, NC - March 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will debut JX-100 in booth 759 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

Juki Automation Systems

Juki’s JX-100 Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:38:26.0

MORRISVILLE, NC - November 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it has been awarded a 2009 Global Technology Award in the category of Placement Equipment (Low/Medium Volume) for its JX-100. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

Juki Automation Systems

Depth Routing- Applications, Advantages And Methods

Industry News | 2012-02-16 02:16:41.0

As miniaturization trends continue this course will make technological improvement and design creativity in the PCB production process indispensable. In various markets there is a rising demand for this kind of high-end technology. And as of today, some PCB shops and markets might stand a better chance to differentiate themselves from their competitors.

APROS Int. Consulting & Services

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